Intel® 7300 ChipsetOverview
The Intel® 7300 Chipset with Data Traffic Optimizations improve data movement across Intel® Xeon® processor 7300 series-based servers by increasing interconnect bandwidth, optimizing system bandwidth, increasing memory capacity, and improving network traffic processing while reducing I/O latency as compared to previous platforms.
The Intel® 7300 Chipset with Data Traffic Optimizations matches the improved performance of the Intel® Xeon® processor 7300 series and Intel® Xeon® processor 7200 series to bring additional performance and platform improvements to the expandable segment. The Intel® 7300 Chipsets incorporate four high-speed interconnects that move data at 1066 MT/s (megatransfers per second), FBDIMM support for up to 256 GB of memory capacity, a 64MB cached snoop filter for reduced traffic on the dedicated high speed interconnects, and next generation improvements to Intel® I/O Acceleration Technology. Additionally, the Intel® 7300 Chipset has 28 lanes of PCI Express* with support for third party expanders for additional I/O.
Product information
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Intel® Xeon® processor 7300 series product brief
File Type/Size: PDF 811KB
Features and benefits
| Supports four Intel® Xeon® processors 7300 series and Intel® Xeon® processor 7200 series | All platforms are optimized for the expandable server market segment (virtualization, database, & ERP). |
|---|---|
| 1066 MHz dual independent buses | Increased bus bandwidth of up to 2X over 800MHz systems. |
| FB DIMM 533/667 MHz memory interface | Offers a maximum memory bandwidth up to 21 GB/s for 667 MHz. Increased dual in-line memory modules (DIMMs) per system provide enhanced memory scalability for memory-intensive applications. |
| PCI Express* I/O1 | Serial I/O technology provides a direct connection between the MCH chipset and PCI Express component/adapters with bandwidth up to 4 GB/s on each PCI Express x8 interface. PCI Express offers higher bandwidth, lower latency and fewer I/O bottlenecks than PCI-X. |
| Intel® 6700PXH 64-bit PCI Hub | Optional component introduces next-generation PCI/PCI-X performance and significant enhancements to platform flexibility. Supports two independent 64-bit, 133 MHz PCI-X segments and two Hot-Plug controllers (one per segment). |
| Advanced platform reliability, availability, and serviceability (RAS) | Features such as memory Error Correction Code (ECC), Intel® x4 Single Device Data Correction (x4 SDDC), DIMM sparing and DIMM scrubbing for improved system reliability. |
Related products
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Packaging information
| Intel® 7300 Chipset Memory Controller Hub (MCH) | 2013 Flip Chip-Ball Grid Array (FC-BGA) |
|---|---|
| Intel® 6700PXH 64-bit PCI Hub | 567 Flip Chip-Ball Grid Array (FC-BGA) |
| Intel® 632xESB I/O Controller Hub | 1284 Flip Chip - Ball Grid Array (PBGA) |
1Intel® chipsets may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current characterized errata are available on request.