Intel® 6700PXH 64-bit PCI Hub Thermal Guide
Introduction
As the complexity of computer systems increases, so do the power dissipation requirements. Care
must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or
passive heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the Intel® 6700PXH 64-bit
PCI Hub component.
• Describe a reference thermal solution that meets the specification of Intel® 6700PXH 64-bit PCI Hub component.
Properly designed
thermal solution provides adequate cooling to maintain the PXH component die temperatures at or below thermal specifications. This is accomplished by providing a
low local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the PXH component die
temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation
outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.
The simplest
and most cost effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts.
When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink
can be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for the Intel® 6700PXH 64-
bit PCI Hub components only. For thermal design information on other chipset components, refer to the respective component datasheet.
Unless otherwise
specified, the term “PXH” refers to the Intel® 6700PXH 64-bit PCI Hub.
Read the full Intel® 6700PXH 64-bit PCI Hub Thermal Design Guide.
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Intel® 6700PXH 64-bit PCI Hub Thermal Guide
Introduction
As the complexity of computer systems increases, so do the power dissipation requirements. Care
must be taken to ensure that the additional power is properly dissipated. Typical methods to improve heat dissipation include selective use of ducting, and/or
passive heatsinks.
The goals of this document are to:
• Outline the thermal and mechanical operating limits and specifications for the Intel® 6700PXH 64-bit
PCI Hub component.
• Describe a reference thermal solution that meets the specification of Intel® 6700PXH 64-bit PCI Hub component.
Properly designed
thermal solution provides adequate cooling to maintain the PXH component die temperatures at or below thermal specifications. This is accomplished by providing a
low local-ambient temperature, ensuring adequate local airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the PXH component die
temperature at or below the specified limits, a system designer can ensure the proper functionality, performance, and reliability of the chipset. Operation
outside the functional limits can degrade system performance and may cause permanent changes in the operating characteristics of the component.
The simplest
and most cost effective method to improve the inherent system cooling characteristics is through careful chassis design and placement of fans, vents, and ducts.
When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink
can be varied to balance size and space constraints with acoustic noise.
This document addresses thermal design and specifications for the Intel® 6700PXH 64-
bit PCI Hub components only. For thermal design information on other chipset components, refer to the respective component datasheet.
Unless otherwise
specified, the term “PXH” refers to the Intel® 6700PXH 64-bit PCI Hub.
Read the full Intel® 6700PXH 64-bit PCI Hub Thermal Design Guide.
