Intel's Packaging Databook Chapter 14: Ball Grid Array (BGA) Packaging
The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high lead count (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems and minimized handling issues. During reflow the solder balls are self-centering (up to 50% off the pad), thus reducing placement problems during surface mount. Normally, because of the larger ball pitch (typically 1.27 mm) of a BGA over a QFP or PQFP, the overall package and board assembly yields can be better. From a performance perspective, the thermal and electrical characteristics can be better than that of conventional QFPs or PQFPs. The PBGA has an improved design-to-production cycle time and can also be used in few-chip-package (FCPs) and multi-chip modules (MCMs) configurations. BGAs are available in a variety of types, ranging from plastic overmolded BGAs called PBGAs, to flex tape BGAs (TBGAs), high thermal metal top BGAs with low profiles (HL-PBGAs), and high thermal BGAs (H-PBGAs).
The H-PBGA family includes Intel’s latest packaging technology—the Flip Chip (FC)-style, H-PB-GA. The FC-style, H-PBGA component uses a Controlled Collapse Chip Connect die packaged in an Organic Land Grid Array (OLGA) substrate. In addition to the typical advantages of PBGA pack-ages, the FC-style H-PBGA provides multiple, low-inductance connections from chip to package, as well as, die size and cost benefits. By providing multiple, low-inductance connections the FC-style, HPBGA offers equivalent or better performance than an extra on-chip metal layer. The FC technology also provides die-size benefits through the elimination of the bond pad ring and better power bussing and metal utilization. The OLGA substrate results in a smaller package, since there is no cavity, and thermal management benefits since the thermal solution can directly contact the die.
Read the full Packaging Databook, Ch. 14.
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Intel's Packaging Databook Chapter 14: Ball Grid Array (BGA) Packaging
The plastic ball grid array (PBGA) has become one of the most popular packaging alternatives for high I/O devices in the industry. Its advantages over other high lead count (greater than ~208 leads) packages are many. Having no leads to bend, the PBGA has greatly reduced coplanarity problems and minimized handling issues. During reflow the solder balls are self-centering (up to 50% off the pad), thus reducing placement problems during surface mount. Normally, because of the larger ball pitch (typically 1.27 mm) of a BGA over a QFP or PQFP, the overall package and board assembly yields can be better. From a performance perspective, the thermal and electrical characteristics can be better than that of conventional QFPs or PQFPs. The PBGA has an improved design-to-production cycle time and can also be used in few-chip-package (FCPs) and multi-chip modules (MCMs) configurations. BGAs are available in a variety of types, ranging from plastic overmolded BGAs called PBGAs, to flex tape BGAs (TBGAs), high thermal metal top BGAs with low profiles (HL-PBGAs), and high thermal BGAs (H-PBGAs).
The H-PBGA family includes Intel’s latest packaging technology—the Flip Chip (FC)-style, H-PB-GA. The FC-style, H-PBGA component uses a Controlled Collapse Chip Connect die packaged in an Organic Land Grid Array (OLGA) substrate. In addition to the typical advantages of PBGA pack-ages, the FC-style H-PBGA provides multiple, low-inductance connections from chip to package, as well as, die size and cost benefits. By providing multiple, low-inductance connections the FC-style, HPBGA offers equivalent or better performance than an extra on-chip metal layer. The FC technology also provides die-size benefits through the elimination of the bond pad ring and better power bussing and metal utilization. The OLGA substrate results in a smaller package, since there is no cavity, and thermal management benefits since the thermal solution can directly contact the die.
Read the full Packaging Databook, Ch. 14.
