IntelŪ PentiumŪ III Processor - Low-Power Module Thermal Design Guide

This application note:

  • Introduces the targeted thermal requirements of the Low-Power Module
  • Discusses attachment methods for thermal solutions
  • Defines targeted thermal parameters and clarifies terminology
  • Identifies the concepts and airflow calculations for the design of thermal solutions. Sample calculations are also provided.
  • Identifies the z-height constraints of a thermal solution for a single slot CompactPCI (CPCI) Low-Power Module design
  • Discusses theory of operation and implementation considerations for various thermal solutions
  • Provides a list of thermal solution vendors for the Low-Power Module


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