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With the Intel® 810E2 chipset, Intel has extended its innovative technology that enhances the performance and exceptional value of embedded computing platform solutions which utilize the Intel® Pentium® III and Celeron® processors. The Intel 810E2 chipset supports both .13 micron and .18 micron process technology for the Pentium III and Celeron processors, 370-pin, in the FC-PGA and FC-PGA2 packages (Flip-Chip Pin Grid Array with integrated heat spreader). The chipsets include a processor side bus that automatically scales from 66 to 133 MHz based on the processor used. This complete platform solution utilizes a single driver featuring full backwards compatibility for increased quality and reliability. The performance of Intel's 3D graphics with Direct AGP is easily upgraded by adding a 4MB Display Cache.
Intel's smart graphics integration makes the Intel 810E2 chipset an intelligent solution for today's complex embedded computing applications. The smart integration in the Intel 810E2 chipset design is extended to feature LAN capability as well as four USB ports. By combining internal graphics, LAN, and support for four USB ports with the ability to take advantage of soft audio/modem technology, the Intel 810E2 chipset delivers an ideal solution for new innovative form factors. Further flexibility can be achieved by taking advantage of the Communication and Network Riser (CNR) card option, which allows for audio, modem, and/or LAN configuration on a single base board design.
Built on next generation chipset technology, the Intel 810E2 chipset offers the performance, stability, and reliability that customers require for embedded computing applications. The Intel 810E2 chipset and drivers reduce support costs, validation costs, and offer a variety of sell-up opportunities while still providing flexibility and performance at value pricing.
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 | Flexible processor support ranging from the Intel Celeron Processor at 300 MHz to the Pentium® III at 866 MHz and beyond running on 66 MHz, 100 MHz or 133 MHz PSB configurations |
| Increased I/O bus bandwidth through the use of Intel® Hub Architecture which allows better concurrency for next-generation embedded computing applications |
| Support for 100 MHz SDRAM enabling cost effective high volume memory |
| 512 MB maximum memory |
| Low power sleep mode for energy savings |
| Four USB ports with two controllers |
| Support for ATA/100 enabling the fastest data & file transfer |
| Alert on LAN 2.0 |
| Integrated LAN connect interface for flexible cost-effective network solutions from home PNA to 10/100 Mbps Ethernet with LAN manageability |
| Intel 3D graphics with Direct AGP for vivid 2D and 3D graphics |
| Support for an add-in Display Cache of up to 4MB to boost performance over similar systems without a display cache |
| AC'97 Controller for better audio quality with up to six channels and surround sound capability |
| Digital Video Output which allows for connection of traditional TV or new digital flat-panel displays; compatible with the DVI specification |
| Soft DVD MPEG-2 playback with HW motion compensation for lifelike audio and video |
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| Product |
Product Code |
Package |
Features |
| 810E2 Graphics and AGP Memory Controller Hub
(GMCH) |
FW82810E |
421 BG |
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Intel Accelerated Hub Architecture |
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Intel 3D graphics with Direct AGP |
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Overall BOM cost savings |
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Optional 4 MB of dedicated display cache video memory (100 or 133 MHz) |
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| I/O Control Hub 2 (for 810E2)(ICH2) |
FW82801BA |
360 EBGA |
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Direct connection to the GMCH with Intel's Accelerated Hub Architecture |
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Supports 32-bit PCI |
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IDE Controllers with ATA100 |
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Four USB ports |
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AC'97 controller with 6 Channel Sound |
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Integrated MAC |
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| Firmware Hub (4MB FWH)**† |
E82802AB
N82802AB |
TSOP
PLCC |
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System BIOS and video BIOS |
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Intel Random Number Generator (RNG) for stronger encryption, digital signing and security protocols |
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| Firmware Hub (8MB FWH)** |
E82802AC
N82802AC |
TSOP
PLCC |
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System BIOS and video BIOS |
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Intel Random Number Generator (RNG) for stronger encryption, digital signing and security protocols |
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| ** Must be purchased as a separate component. |
| † Contact your local Intel field sales representative for product availability. |
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