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Intel® 3210 Chipset For embedded computing

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Intel® 3210 Chipset

The Intel® 3210 Chipset includes Error Correcting Code (ECC) memory for embedded applications that need high reliability, such as robotics on a factory floor, multi-function printers and network security applications. This server class chipset, with embedded life cycle support, provides robust I/O performance and memory speed for fast system responsiveness required in mid-range network security appliance, print imaging, storage and I/O-intensive industrial applications.

Product information

Product highlights

  • 1333/1066/800 MHz front-side-bus (FSB) for use with a variety of pin-compatible LGA 775 socket processors to meet a wide range of performance needs, as well as reliability and scalability, for embedded applications:
    • 45nm Intel® Core™2 Quad processor Q9400Δ offers exceptional performance with four complete execution cores within a single processor.
    • 45nm Intel® Core™2 Duo processors E8400Δ and E7400Δ offer dual-core, energy-efficient performance.
    • 65nm Intel® Core™2 Duo processor E6400Δ and Intel® Celeron® processor 440Δ balance proven technology with exceptional value.
  • PCI Express* 2x8 or 1x16 I/O port enables faster I/O transactions to help peripherals keep up with high-performance platforms. An additional port supports further expansion possibilities.
  • ECC memory supports a high level of data integrity, reliability and system uptime. Detects multiple-bit memory errors and locates/corrects single-bit errors to keep applications running smoothly and prevent stealth data corruption.
  • Up to 12.8 GB/s memory speed (800 MHz DDR2 dual 6.4 GB/s) and 8 GB memory addressability helps maximize system bandwidth and performance and eliminate slowdowns from memory bottlenecks.
  • Intel® Matrix Storage Technology with integrated RAID 0, 1, 5, or 10 accelerates data access to support high user productivity and storage applications. Protects operations by allowing recovery of data in the event of a hard drive failure.
Intel® 3210 Chipset for embedded computing
Product Product Code Package Features
Intel® 3210 Memory Controller Hub (MCH) NU3210MC 1300 Flip Chip Ball Grid Array (FC-BGA) 1333/1066/800 MHz system bus; DDR2 800/667 with ECC support; PCI Express* I/O interface with 1 x16 or 2 x8 support.
Intel® I/O Controller Hub 9R (Intel® ICH9R) FW82801IR 31 mm 652-pin PBGA Four PCI masters and six PCI Express* x1 channels; four SATA ports; 12 Hi-Speed USB 2.0 ports; dual EHCI controllers; enhanced SPI interface; integrated 10/100/1000 MAC; RAID 0,1, 5 and 10; and Intel® Matrix Storage Technology.
Intel® 82566DC Gigabit Ethernet Controller (optional) RU82566DC 10x10 mm 81-pin FCMMAP (BGA) Smaller footprint and lower power dissipation compared to multi-chip MAC and PHY solution; 10/100/1000 Mb/s data transfer; footprint compatible with Intel® 82562V 10/100 Network Connection.
Intel® 6702PXH 64-bit PCI Hub (optional) QG6702PXHV 567-pin Flip Chip Ball Grid Array (FC-BGA) Compatible with PCI Express* 1.0a; compliant with PCI spec rev 2.3 and PCI Standard Hot-plug Controller* spec rev 1.0; electrically compliant with System Management Bus 2.0 spec with PEC support.
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