Intel® 80312 I/O Companion Chip

This is the Advance Information datasheet for the Intel® 80312 I/O companion chip. This datasheet contains a functional overview, mechanical data (package signal locations and simulated thermal characteristics), targeted electrical specifications (simulated), and bus functional waveforms. Detailed functional descriptions other than parametric performance is published in the Intel® 80312 I/O Companion Chip Developer?s Manual.

Intel and Intel XScale Microarchitecture are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United States and other countries.

ARM and StrongARM are registered trademarks of ARM, Ltd.

Specification Update for this document: 273416.htm

File Name/Size:
27342508.pdf

882778 bytes
Download From:
FTP Server

Web Server (Available for byte serving)