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Products
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Features & Benefits |
Chassis Specifications |
Product Names
The Intel® IXDP2351 Advanced Development Platform enhances the value of the Intel® IXP2350 network processor by providing a robust environment that can dramatically accelerate the development and validation of new products designed for T1/E1/J1 to OC-12 line rates. The development platform may be used in several ways:
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Developers can write code and run simulation in a Windows*-based PC environment using the graphical workbench and the cycle-accurate simulator, and then verify system functionality even before the target hardware is available. |
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Hardware design engineers can use schematic source files and other design documents, such as design guides and mechanical drawings included in the web-based Intel® Internet Exchange Architecture (Intel® IXA) Hardware Development Kit to jump-start board development. |
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Developers can validate a design using the base card, network processor module, and mezzanine cards available from Intel, or design and test a custom I/O subsystem using the development platform prior to committing to a full board design. |
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With the IXDP2351 platform, developers can add extra AdvancedTCA* boards from Intel as well as third parties to prototype more complete systems. |
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Developers can support a variety of AdvancedTCA fabric interfaces through a defined fabric interface mezzanine. |
| Processor |
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Single Intel® IXP2350 network processor configured to run at various Intel XScale® core and microengine speed rates |
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| Interfaces |
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SPI-3 for mezzanine/fabric |
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Media Switch Fabric (MSF) configurable to support: SPI-3, HSS, Fast Ethernet, UTOPIA Master or Slave and Gigabit Ethernet mode |
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| Memory |
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64MB flash memory |
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One QDR SRAM channel: with a modular QDR-II interface for an optional 16MB QDR-II SRAM module (up to 200 MHz/400 MT or a TCAM module — available from third parties) |
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768 MB DDR DRAM + ECC
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512MB CPP DDR DRAM + ECC |
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256MB XSI DDR DRAM + ECC |
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| I/O Option Cards |
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Intel® IXD4OC12T1F Quad OC-3/OC-12 I/O Option Card (four port OC-3 and two port OC-12 are supported) |
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Intel® IXD4GET0C Quad Gigabit Ethernet I/O Option Card - Copper (Only two GbE ports usable with IXDP2351 development platform) |
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Intel® IXD16DS1T2C 16-port T1/E1/J1 RTM |
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| Memory Modules |
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Intel® IXQDR2416 16MB QDR-II SRAM Memory Module |
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| Description |
Intel® IXDP2351 Chassis |
| Regulatory Information |
 | Complies with FCC Part 15, ICES-003, CE (EN55022), VCCI, GOST-R, and RRL MIC for Class A Emissions |
| Complies with CISPR 24/EN55024, EN61000-3-2, EN61000-3-3 |
| Complies with IEC/EN/UL 60950 for UL/cUL, CE, and GOST-R |
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| Physical Dimension |
436mm x 386mm x 5U |
| Weight (chassis only - fully loaded system) |
31 lb. chassis only; up to 70 lbs. for fully loaded system |
| Power Input |
Autosensing 100-240 VAC, 50-60 Hz, 15-7.4 Amps |
| Power Supply Output (External) |
-48 VDC (25A), 1200 watts |
| Operating Temperature |
0° to 40° C |
| Storage Temperature |
-40° to 70° C |
| Standards Compliance |
PICMG 3.0 AdvancedTCA Chassis specifications |
| Cooling |
200W per slot |
| Backplane |
Mounting provision for five (5) 8Ux280mm AdvancedTCA boards and five (5) 8Ux70mm Rear Transition Modules and two (2) Schroff 4Ux4HP shelf managers |
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| Intel® IXDP2351 Advanced Development Platform |
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Intel® IXDP2351 Advanced Development Platform (includes Intel® IXMB2351 Base Card, Chassis, Shelf Manager and 1200W external power supply) |
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| Base Card |
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Intel® IXMB2351 Single Network Processor Base Card (includes Intel® IXNPM2350 Network Processor Module) |
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| Option Cards |
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Intel® IXD4OC12T1F Quad OC-3/OC-12 I/O Option Card |
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Intel® IXD4GETOC Quad Gigabit Ethernet I/O Option Card |
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Intel® IXD16DS1T2C 16-port T1/E1/J1 I/O Option Card |
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Intel® IXQDR2416 16MB QDR-II SRAM Memory Module Option Card |
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