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| | Intel® Packaging Information |
| | Packaging Databook |
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| Purpose of the Databook |
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The Intel® Packaging Databook is intended to serve only as a data reference guide to Intel package selection and availability. As the packaging landscape changes very rapidly, information can become outdated very quickly. Please refer to the product specifications on the Products site for the most current detailed package information.
Chapter 1: Introduction (PDF 271KB)
An overview of package families, including package attributes, package types, and a package selection guide.
Chapter 2: Package/Module/PC Card Outlines and Dimensions (PDF 1966KB)
A detailed view into Intel package outlines and dimensions.
Chapter 3: Alumina and Leaded Molded Technology (PDF 205KB)
Statistical tools used in the manufacturing process. Also included is a comprehensive analysis of Intel's IC assembly manufacturing technology and process flow.
Chapter 4: Performance Characteristics of IC Packages (PDF 747KB)
Package characteristics and data for electrical, mechanical, and thermal IC package characteristics.
Chapter 5: Physical Constants of IC Package Materials (PDF 101KB)
Physical constants of IC package materials. This chapter provides valuable information on mechanical, electrical, and thermal properties of case materials, lead/leadframes, and soldering material characteristics.
Chapter 6: ESD/EOS (PDF 53KB)
An overview of electrical static discharge and electrical over stress. ESD/EOS precautions are described.
Chapter 7: Leaded Surface Mount Technology (SMT) (PDF 101KB)
A review of the mass reflow soldering technologies of printed circuit board (PCB) component assembly termed SMT (surface mount technology).
Chapter 8: Moisture Sensitivity/Desiccant Packaging/Handling of PSMCs (PDF 269KB)
Desiccant Packing Methods and Materials. The six levels of moisture sensitivity for packages is also examined.
Chapter 9: Chapter 9: SMT Board Assembly Process Recommendations (PDF 931KB)
Suggested process parameters for Pb-free SMT board assembly reflow and rework.
Chapter 10: Shipping and Transport Media (PDF 357KB)
Various packing and shipping methods used at Intel. Packing media, desiccant pack materials, and shipping data are illustrated.
Chapter 11: International Packaging Specifications (PDF 38KB)
A listing of international packaging specifications and a comprehensive resource library.
Chapter 12: Tape Carrier Package (PDF 292KB)
A profile of the Tape Carrier Package and its uses in areas that require lightweight small footprint integrated circuits.
Chapter 13: Pinned Packaging (PDF 751KB)
An overview of Plastic Pin Grid Array package technology, and its physical structure, electrical modeling and performance.
Chapter 14: Ball Grid Array (BGA) Packaging (PDF 795KB)
A profile of the Plastic Ball Grid Array package technology detailing its physical structure, electrical modeling, performance, and other aspects of the PBGA package.
Chapter 15: The Chip Scale Package (CSP) (PDF 212KB)
An overview of Chip Scale Packaging options, their physical structure, electrical modeling, and dimensional criteria.
For Flash and Wireless product packages, more information is available at:
Intel® Wireless Communications and Computing Package User's Guide
Chapter 16: Cartridge Packaging (PDF 476KB)
An overview of Cartridge Packaging and its physical structure, electrical modeling, and performance.
Chapter 17: Material Content of IC Packaging
An overview of the material composition of Intel products with information on a) materials that may be used in Intel products, b) restricted/banned substances, and c) materials content data. Materials Declaration Data Sheets (MDDS) for several packaging families are also provided. Users of MDDSs are responsible for consulting this chapter regularly to ensure they are using the most recent MDDS version. The Intel Dear Customer Letter (DCL) for General Materials and RoHS Declaration and MDDS represent the signed Supplier Declaration of Conformance (SDoC) for EU RoHS.
If you cannot find the MDDS for a particular product, please contact your Intel Field Rep. If you do not have an Intel Rep, send an email with your contact information and the product(s) codes and MM# to RoHS@Intel.com.
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