Quality and Reliability Resources

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Intel quality and reliability documentation

  • Manufacturing with Intel® Xeon® Processor 7500 Series-Based Platform (Boxboro EX Rev 3.5) Curriculum

    File Type/Size:  PDF 7.42MB


    The Intel® 7500 chipset is the first multi-processor server platform to use the Land Grid Array socket (LGA 1567) socket with Intel® architecture LGA1567 socket features increased ball count (1567) compared to previous Intel platforms. Intel 7500 chipset utilizes an Independent Loading Mechanism (ILM) to maintain the interface between the socket and the processor. Intel anticipates some changes to the In-Circuit Test process which includes adequate test point access / coverage. This course will provide manufacturing guidelines that will address the new challenges posed by Intel 7500 chipset platform.
  • Material Declaration Data Sheets (MDDS)
    Search, view, and download Material Declaration Data Sheets for Intel® products.
  • Product Change Notifications (PCN)
    Search, view, and download Product Change Notifications, including Product Discontinuance Notifications, for Intel products.
  • Product regulations
    View product regulations (Declarations of Conformity).
  • Regulatory certificates for Intel products
    View regulatory certifications for Intel product compliance with international importation directives and procedures.
  • Manufacturing with Intel® Products: System Manufacturing Test to Meet Quality Goals

    File Type/Size:  PDF 309KB


    This MAS course shares Intel learning about System Manufacturing Testing, including why we test, test architecture overview, platform test, and the software design envelope.
  • Manufacturing with McCreary/Boulder Creek Platform

    File Type/Size:  PDF 2.04MB


    This MAS course shares Intel learning to facilitate customer manufacturing as an advantage service for McCreary and Boulder Creek platforms for Digital Office (business) and Digital Home (consumer) applications.
  • Manufacturing with Intel® Itanium® processor 9300 series platform (aka Boxboro MC)

    File Type/Size:  PDF 8.73MB


    This MAS course shares Intel learning to facilitate customer manufacturing as an advantage service for the new platform. The platform includes Intel® 7500 Scalable Memory Buffer, Intel® 7500 Input/Output Hub (IOH) and Intel® IOP348 I/O Processor to support the Intel® Itanium® processor 9300 series, Intel® I/O Controller Hub 10 (ICH10), Intel® 82575 Gigabit Ethernet Controller (82575), Intel® 82576 Gigabit Ethernet Controller (82576), Intel® 82598 10 Gigabit Ethernet Controller (82598), Intel® 82599 10 Gigabit Ethernet Controller (82599), Ararat and Ararat II voltage regulator (VR) are included in this platform. The processor is a 1248-Land FCLGA package that interfaces with the motherboard via the LGA1248 socket. Socket collaterals are discussed throughout this document.
  • Manufacturing With Intel® Piketon, Kings Creek & Foxhollow Platforms

    File Type/Size:  PDF 6.79MB


    This MAS course shares Intel learning to facilitate customer manufacturing as an advantage service for Intel® Piketon, Kings Creek and Foxhollow Platforms which are based on a new generation of Intel® microarchitecture code name Nehalems.
  • WiMAX PCI-e MiniCards Handling Guidelines

    File Type/Size:  PDF 554KB


    Handling Guidelines for the Intel® Centrino® Advanced-N + WiMAX 6250 PCI-e Half MiniCards (HMC) which are thinner than standard motherboards or PCI NIC cards and are thus are more susceptible to solder joint damage related to bow and flex forces applied in assembly.
  • ISO registrations
    Intel uses the ISO 9001:2000 International Standard as the baseline for our quality system. All of Intel's mature manufacturing wafer fabrication, assembly/test sites, and logistics centers are registered to ISO 9001:2000 by a third-party registrar.
  • Manufacturing enabling collateral

    File Type/Size:  PDF 69KB


    Learn how to register to search, view, and download manufacturing enabling collateral for Intel® technologies.
  • Manufacturing with Intel® Weybridge Platform (also know as Bearlake Platform) MAS

    File Type/Size:  PDF 760KB


    Intel® Core™2 Duo Processor interfacing with the motherboard via a (Land Grid Array) LGA775 socket. Intel® 3-Series Chipset Family ATX, μATX, BTX, μBTX, and pBTX board form factors
  • Manufacturing with the Intel® Tylersburg Platform

    File Type/Size:  PDF 4.64MB


    Tylersburg High-end desktop (HEDT) platform will use a new LGA1366 socket with backplate for Intel® Core™ i7 (previously Bloomfield) processor.
  • Land Grid Array (LGA) Socket and Package Technology: Handling, Inspection, and Integration Module

    File Type/Size:  PDF 1.67MB


    The enabling documentation focuses on key learnings from Intel reference process development.
  • Manufacturing with the Intel® Products: Intermediate-Box (I-Box, IBox) Handling Recommendations

    File Type/Size:  PDF 2.20MB


    Intel® products are shipped using 2-box* packaging in general. This enabling documentation outlines the importance of proper handling.

Intel quality and reliability videos

  • LGA115x System Integration
    This 9-minute video describes Intel's BKM on LGA115X Integration to avoid handling damages to socket contacts. Various LGA processor insertion/removal tools are introduced. (Click here for Chinese version)
  • LGA115X Motherboard Integration
    This 9-minute video describes Intel's BKM on LGA115X Integration to avoid handling damages to socket contacts. Various LGA processor insertion/removal tools are introduced. (Click here for Chinese version)
  • Measuring I/O Shield Alignment
    This 4-minutes video demonstrates the measuring of IO ports alignment with the Chassis. Board IO ports should fit in the Chassis openings to ensure proper EMI shield and noise control.
  • Manufacturing with Intel® components strain measurement for circuit board assembly: vishay strain gage
    This video demonstration will outline the proper method to attach strain gages to the primary side of boards for Intel Ball-Grid-Array packages and using the Plan-Of-Record location. These are used to measure transient bending or flexure which may be induced along the assembly line during the manufacturing process.
  • Manufacturing with Intel® components strain measurement for circuit board assembly: kyowa strain gage
    This video demonstration will outline the proper method to attach strain gages to the primary side of boards for Intel Ball-Grid-Array packages and using the Plan-Of-Record location. These are used to measure transient bending or flexure which may be induced along the assembly line during the manufacturing process.
  • Handling recommendations
    This video showcases the best practices for setting safe, efficient handling standards; incorporating methods and practices that ensure consistent quality and minimize defects and accidents.
  • Electro-static discharge methods
    This video provides an overview of Intel's prevention methods of ESD, device models and theory. It applies case studies related to equipment qualification requirements for ESD compliance.
  • Manufacturing methods - Unit Level Traceability auto strap
    This video provides an overview of Intel's Unit Level Traceability (ULT) system, a technology developed to address the complexities that exist with the introduction of new manufacturing technologies in Assembly/Test in Intel. Video playing time is 4 minutes.
  • BGA rework recommendations
    This video provides an overview of Intel's rework method for chipset and processor sockets in a BGA package.
  • CPU Insertion and Removal with LGA771 or LGA775 Socket
    This video provides processor insertion and removal procedures for Intel® processors with LGA771 or LGA775 sockets
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