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- Non-Destructive Testing
Non-Destructive TestingNon-destructive techniques have the advantage of providing data without physical alteration of the electronic device. The five major techniques used are X-ray, Scanning Acoustic Microscopy (SAM), Superconducting Quantum Interference Device (SQUID), Time Domain Reflectometry (TDR), and Thermal Imaging.
X-ray
The X-ray tool analyzes density differences among the materials in electronic devices. It is used mostly during package analysis where C4 bumps and metal traces, such as wires, show a high contrast to all other materials.
Scanning Acoustic Microscopy (SAM)
Scanning Acoustic Microscopy is used to measure the acoustic impedance of electronic devices. Reflections and transmissions of pulsing sound waves show the acoustic density differences between materials.
Superconducting Quantum Interference Device (SQUID)
The Superconducting Quantum Interference Device is a very sensitive magnetic sensor that measures electromagnetic fields caused by current flow. It is mostly used to detect resistive and solid shorts on a macroscopic scale.