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In order to facilitate the conversion process and proactively communicate changes to customers, Intel publishes this monthly change summary. Changes are classified as follows:
Class 1
- Major changes that impact the form, fit or function of the end product
and for which a requalification should be anticipated. (e.g. major redesign of
board, peripheral or power supply changes, BIOS changes, major firmware changes,
changes that affect acoustics, thermal, EMI, safety or certification requirements.)
Class 2
- Changes that have a minor affect on the form, fit or function but which would be evident at the customer site. (e.g. minor logic changes for bug correction, part changes, firmware revisions)
Class 3
- Changes that do not affect form, fit or function of a product. These are changes that will not impact customers manufacturing process and/or their
application. (e.g. factory process changes, component second source changes, supplier changes)
APGX_MCS.PDF
Size: 87829 bytes
Date: 3/27/98

Note: PDF Files require Adobe Acrobat* Reader†

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This applies to:
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