Intel discovered a manufacturing defect in which the rubber bumper that fits on the LAN boards of the Intel® Remote Managamenet Module 2 (RMM2) is greater than the required 2.5mm thickness.

If the affected LAN board is installed, the RMM2 may become dislodged from the connector in the system. Only customers using the SR1500AL, SR1550AL or SR1560SF system will be impacted by this issue due to the position of the installed RMM2.

	Technical Advisory 938 (PDF)
	File Name: ta93801.pdf Date: October 2009

This applies to:

Intel® Server Board S5000PAL Intel® Server Board S5400SF Intel® Server System SR1560SF