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	Technology and Research Intel Technology Journal

Second-Generation Intel^® Centrino^® Mobile Technology

Volume 09 Issue 01 Published February 17, 2005
ISSN 1535-864X DOI: 10.1535/itj.0901

Introduction

	Second-Generation Intel^® Centrino^® Mobile Technology Platform
	By Shreekant (Ticky) Thakkar Director of Mobile Technology, Intel Corporation
	Read about the technologies and features of the second-generation Intel^® Centrino^® mobile technology platform, and the new usage models that enabled it.

Current Articles

Platform

	Intel^® 915GMS Chipset: In Mobile Platforms, Smaller is Better
	Discover the steps Intel took to design the significantly smaller Intel^® 915GMS chipset package in order to continue to drive the thinner, lighter designs vector of mobility.

	The Emergence of PCI Express* in the Next Generation of Mobile Platforms
	Examine the unique values of the PCI Express* state-of-the-art platform solution–including high-bandwidth scalability, easy networking, improved power management, and network reliability–in the second generation of mobile platforms.

	High-Performance Graphics and TV Output Comes to the Second-Generation Intel^® Centrino^® Mobile Technology Platform
	Learn about the key architectural challenges associated with attaining higher-than-expected graphics performance and high-quality TV output support, making the second-generation platform built on Intel^® Centrino^® mobile technology an essential part of the digital home.

	Low-Power Audio and Storage Input/Output Technologies for the Second-Generation Intel^® Centrino^® Mobile Technology Platform
	A key requirement for the second-generation mobile platform is to increase functionality while not using more power. Take a close look at two key Input/Output (IO) technologies—integrated audio and the interface to the storage device (hard drive)—as compared to previous solutions.

Power and Thermal Management

	Performance and Power Consumption for Mobile Platform Components Under Common Usage Models
	Discover some of the new features of the second-generation PC platform built on Intel^® Centrino® mobile technology and the impact they have on platform performance and power.

	Interface Material Selection and a Thermal Management Technique in Second-Generation Platforms Built on Intel^® Centrino^® Mobile Technology
	Notebook system designs vary significantly, but all are densely packed with components and devices, leaving little room for cooling. Examine two methods for dealing with the thermal challenges in the second-generation mobile platform built on Intel^® Centrino^® mobile technology.

Mobility Usage Models

	Next-Generation PC Platform Built on Intel^® Centrino^® Mobile Technology New Usage Models
	Explore the capabilities of the second-generation mobile platform and the interfaces and wireless ecosystem used to enable new usage models: Extended Mobile Access (EMA), Voice over Internet Protocol (VoIP), Simplified Network Selection (SNS), and One Bill Roaming (OBR).

Preface


	Lin Chao Publisher Intel Technology Journal As we enter the ninth year of publication of the Intel Technology Journal, we bring to our readers an updated web layout and easier navigation for a better reader experience. We continue to provide pdf files for each paper and a combined pdf for the entire issue. For the first time, we are using Digital Object identifiers (DOIs), content identifiers, for web documents similar to ISSN numbers for serial print publications. DOIs provide persistent tagging of online content, addressing actual content rather than location. more...