Ravi Prasher
Ravi Prasher received his B.Tech. degree from the Indian Institute of Technology, Delhi in 1995 and his Ph.D. degree in Mechanical Engineering from Arizona State University in 1999. He joined the Assembly Technology Development (ATD) Group in Intel in 1999. He is also an adjunct professor in the Department of Mechanical & Aerospace Engineering at ASU. He has published approximately 50 archival journal and conference articles and two book chapters in edited volumes. He currently holds 11 patents with 21 patent applications pending with the US patent office. His primary research and technology development interests are in using nano and micro systems to enhance the conductive, convective, and radiative properties of materials including solids and liquids. His e-mail address is ravi.s.prasher at intel.com.

Je-Young Chang
Je-Young Chang received his B.S. and M.S. degrees from the Seoul National University in Korea and his Ph.D. degree from University of Texas at Arlington, all in Mechanical Engineering. He has worked at Penn State University for three years as a post-doc researcher. He joined Intel in 2000, and has worked on many aspects of thermal solutions for mobile processors and platforms, and is currently involved in developing advanced thermal package technologies. He has published over 30 articles in archival journals and conference proceedings. His e-mail address is je-young.chang at intel.com.

Ioan Sauciuc
Ioan Sauciuc is a senior engineer working in the Intel ATD group. He received his Ph.D. degree at the Royal Melbourne Institute of Technology in Australia. He has twenty years of experience in the thermal/heat transfer industrial and research areas. He has published approximately 40 journal and conference articles and he has edited one book. He currently holds 12 patents in USA and Japan with another 20 patent applications pending with the US patent office. His primary research and technology development interests are in thermal and mechanical modeling of cooling devices. His e-mail address is ioan.sauciuc at intel.com.

Sridhar Narasimhan
Sridhar Narasimhan is a senior packaging engineer working in the ATD group at Intel. He received his Ph.D. degree in Mechanical Engineering from the University of Minnesota. His areas of interest include thermal phenomena in electronic packages, thermo-electric coolers, Finite Element Methods (FEM) and Computational Fluid Dynamics (CFD). His e-mail address sridhar.narashimhan at intel.com.

David Chau
David Chau received his B.S., M.S., and Ph.D. degrees from Arizona State University, all in Mechanical Engineering. He has worked for General Motors in environmental temperature testing, and he was one of two project engineers who developed the Hydraulic Refrigeration System Test Facility at ASU in 1992-96. He joined the ATD group of Intel in 2000. He has a wide range of theoretical, experimental, and applied interests in thermoscience, especially in electronic packages and advanced thermal solutions, refrigeration systems, ice thermal storage systems, desalination systems, hydraulic gas compression applications, microscale applications, indoor air quality, and energy systems. His e-mail address is david.s.chau at intel.com.

Greg Chrysler
Greg Chrysler is a principal engineer and thermal team leader in the Intel Materials Technology Operation organization at Chandler, Arizona. His team is responsible for identifying strategic material requirements for future generations of microprocessor packages and systems, thermal path finding, and new supplier and technology identification. He received his Ph.D. degree in Mechanical Engineering, specializing in Thermal Sciences, from the University of Minnesota in 1984. He has co-authored several technical papers, was an Associate Editor of the ASME Journal of Heat Transfer, and holds 49 patents in high-density packages for electronics. His e-mail address is greg.chrysler at intel.com.

Alan Myers
Alan Myers received his B.S. degree in Metallurgical Engineering from the University of Illinois at Chicago in 1984 and his Ph.D. degree in Materials Science from the University of Illinois at Champaign Urbana in 1991. He joined the Portland Technology Development division of Intel in 1992 and is currently a member of the External Programs division of Intel. He has published approximately 20 archival journal and conference articles. He currently holds 20 patents with an additional 18 patent applications pending with the US patent office. After working for the past three years as an Intel Researcher in Residence at Stanford University investigating electroosmotic pumps and microchannel cooling, he currently is working on developing Extreme Ultraviolet Lithography for high-volume manufacturing operations. His e-mail address is alan.m.myers at intel.com.

Suzana Prstic
Suzana Prstic received her M.S. degree in Mechanical Engineering from the University of Minnesota in 2001 and began her professional career as a thermal engineer at ATD in Intel. Her research interests are in thermal management of electronic systems. She is a member of SWE and ASME. Her e-mail address is suzana.prstic at intel.com.

Chuan Hu
Chuan Hu received his B.S. degree from the Beijing University in 1992 and his Ph.D. degree from the University of Texas in 2000, both in solid state physics. He joined the Components Research group at Intel after graduating from the University of Texas. He has authored over 20 technical papers on low k characterization, heat transfer in nano material, and interface and electronic packages. His e-mail address is chuan.hu at intel.com.