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Intel® Centrino® Duo Processor Technology
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Intel® Centrino® Duo Mobile Technology
Volume 10    Issue 02    Published May 15, 2006
ISSN 1535-864X    DOI: 10.1535/itj.1002.03
  Section 1 of 8  
Power and thermal management in the Intel® Core™ Duo processor
Alon Naveh, Mobility Group, Intel Corporation
Efraim Rotem, Mobility Group, Intel Corporation
Avi Mendelson, Mobility Group, Intel Corporation
Simcha Gochman, Mobility Group, Intel Corporation
Rajshree Chabukswar, Software Solutions Group, Intel Corporation
Karthik Krishnan, Software Solutions Group, Intel Corporation
Arun Kumar, Software Solutions Group, Intel Corporation

Index words: Intel Core Duo, ACPI, power, thermal

Citation for this paper: Naveh, A.; Rotem, E.; Mendelson, A.; Gochman, S.; Chabukswar, R.; Krishnan, K.; Kumar, A.  "Power and Thermal Management in the Intel® Core™ Duo processor" Intel Technology Journal. http://developer.intel.com/technology/itj/2006/volume10issue02/
art03_Power_and_Thermal_Management/p01_abstract.htm
(May 2006).
Abstract

The Intel® Core™ Duo processor is the first mobile processor that uses Chip Multi-Processing (CMP) on-die technology to maximize performance and minimize power consumption. This paper provides an overview of the power control unit and its impact on the power-saving mechanisms. We describe the distribution of P-states and look at other techniques used to improve the system power consumption including the impact of multi-threading on power consumption. Then, we provide recommendations on optimizing for CMP and building power-friendly applications.

  Section 1 of 8  

In this article
Abstract
Introduction
Power and thermal management
Experiment results of power management
Software recommendations for power saving with multi-threading
Conclusion and remarks
References
Authors' biographies
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