Technology with the Environment in Mind

Materials Technology for Environmentally Green Micro-electronic Packaging

Mukul P. Renavikar, Technology and Manufacturing Group, Intel Corporation
Neha Patel, Technology and Manufacturing Group, Intel Corporation
Ashay Dani, Technology and Manufacturing Group, Intel Corporation
Vijay Wakharkar, Technology and Manufacturing Group, Intel Corporation
George Arrigotti, Technology and Manufacturing Group, Intel Corporation
Vasu Vasudevan, Technology and Manufacturing Group, Intel Corporation
Omar Bchir, Technology and Manufacturing Group, Intel Corporation
Amruthavalli P. Alur, Technology and Manufacturing Group, Intel Corporation
Charan K. Gurumurthy, Technology and Manufacturing Group, Intel Corporation
Roger W. Stage, Technology and Manufacturing Group, Intel Corporation

Index words: Pb-free, halogen-free, solder materials, thermal interface materials, package and board reliability, BGA, substrates, micro-electronic packaging, EU RoHS, Controlled Collapse Chip Connection (C4)

Citations for this paper. Renavikar, M.; Patel, N.; Dani, A.; Wakharkar, V.; Arrigotti, G.; Vasudevan, V.; Bchir, O.; Alur, A.; Gurumurthy, C.; Stage, R. "Materials Technology for Environmentally Green Micro-electronic Packaging." Intel Technology Journal. http://www.intel.com/technology/itj/2008/
v12i1/1-materials/1-abstract.htm (February 2008).

ABSTRACT

Intel has been continuously striving to provide environmentally green micro-electronic packaging solutions for high-density interconnect (HDI) product applications. The environmentally green initiative consisted of providing lead-free (Pb-free) packaging materials solutions as well the enabling of halogen-free (HF) substrates technology to eliminate the use of brominated flame retardants. This paper discusses the challenges overcome by Intel to deliver on both aspects of environmentally green packaging. Although Intel's efforts to enable Pb-free and HF-compliant packaging solutions have been wide-ranging, the scope of this paper is limited to discussing the key technology development challenges faced in transitioning to Pb-free materials in first-level interconnects (FLI), second-level interconnects (2LI), solder thermal interface materials (STIM) applications, and halogen-free (HF) substrate materials. The transition to Pb-free micro-electronic packaging materials and HF substrate technology required a paradigm shift in the industry, needing extensive benchmarking initiatives and sharing cross-technology learnings across the industry and academia. The delivery of Pb-free packaging solutions across FLI, 2LI, and STIM applications as well as HF substrate technology has strongly reinforced Intel's One Generation Ahead (OGA) philosophy in micro-electronic packaging.

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