Technology with the Environment in Mind

  Section 7 of 10  

Materials Technology for Environmentally Green Micro-electronic Packaging

CONCLUSION

The implementation of Pb-free and HF-compliant packaging materials is critical to Intel, and it is vital to Intel's broader strategy to support an environmentally sustainable future for its industry. Enabling of Pb-free materials with robust resistance to Pb-free assembly processing was made possible through prudent downselection of solder TIM materials, FLI solder, and substrate materials, 2LI ball attach and surface-mount paste materials, and BGA solder metallurgy. The transition to HF-compliant substrate materials posed significant assembly and reliability challenges that were addressed and successfully met. The transition to Pb-free packaging and HF-compliant substrate materials was achieved through close collaboration with industry partners, suppliers, and our customer base, and we had to establish a robust materials supply infrastructure to sustain the environmentally green micro-electronic packaging ecosystem. The adoption of these initiatives has maintained Intel's OGA philosophy in micro-electronic packaging.

  Section 7 of 10  

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