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Volume 12, Issue 01

Technology with the Environment in Mind


Intel Technology Journal - Featuring Intel's recent research and development

ISSN 1535-864X DOI 10.1535/itj.1201.07

  • Volume 12
  • Issue 01
  • Published February 21, 2008

Technology with the Environment in Mind

  Section 12 of 12  

Evaluation Process for Semiconductor Fabrication Materials that are Better for the Environment

AUTHORS’ BIOGRAPHIES

Victor S. Fan
Victor S. Fan is a Senior TD Materials Engineer with Strategic EHS Programs in Intel's Global Fab materials (GFM). His experience with Intel includes chemical EHS characterization, business program establishment, and as an Intel representative to SEMATECH. Experience outside Intel includes engineering and management positions in petrochemical and health care industries. He received an M.S. degree from Harvard University and a PhD degree from Johns Hopkins University.

David Harman
David Harman is a Senior Environmental Engineer in the Intel Technology Development EHS Group. He works on a variety of strategic and technical programs to support materials, equipment, and process development of new technologies. He also is the Intel representative to Sematech EHS programs. He has a B.S. degree in Chemical and Environmental Engineering from the University of Arizona.

Jim Jewett
Jim Jewett is a Principal Engineer and Manager of Global Fab materials' (GFM) EHS group, whose responsibility is to ensure that Fab materials provide cost-effective environmental and health solutions in their design and selection, while enabling Fab process technologies and maintaining a secure supply chain. In addition to the internal responsibilities, Jim chairs both the Chemical (EHS) Management program for the World Semiconductor Council and the International Technical Working group on EHS for the ITRS (International Technology Roadmap for Semiconductors). He is Intel's Industrial Advisory Board member to the SRC/SEMATECH Engineering Research Center for Environmentally Benign Semiconductor manufacturing. During his 23 years at Intel, Jim has remained focused on environmental programs while belonging to a variety of organizations including Corp EHS, Fab manufacturing, Components Research and Materials.


Robert (Bob) Leet
Robert (Bob) Leet is a Senior TD Materials Engineer at Intel Corporation, in Portland, Oregon, USA. He holds a Bachelor's and Master's degree in Chemical Engineering from Arizona State University, his Master's degree focusing on Semiconductor Processing and Manufacturing. He has a specialty in Environmental Health and Safety business processes and information systems for Intel's Global Fab materials organization. He is the holder of four patents and has four patents pending for semiconductor devices as well as waste treatment technology. He has published several industry-forum papers related to both corporate responsibility and government regulatory topics. Bob is a founding member of the EICC (Electronics Industry Citizenship Coalition) and participates in several working groups within the semiconductor and electronics industries.

Dawn E. Speranza
Dawn E. Speranza has held various positions in the EHS field and is currently a Senior TD Materials Engineer and REACH program manager for the Intel Global Fab materials EHS group. Prior to this, Dawn was on assignment at International SEMATECH where she managed various global chemical initiatives and EHS assessments of new materials and processes for advanced technologies. She also worked at the Intel Hudson facility in Construction Safety, Mergers and Acquisitions, Industrial Hygiene, and Occupational Safety. She has a B.S. degree from Tulane University and an M.S. degree from the University of Massachusetts at Amherst. Dawn is a certified Industrial Hygienist and Safety Professional. She currently holds the position of president elect on the SESHA (Semiconductor Environmental, Safety and Health Association) board of directors.

  Section 12 of 12

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