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Volume 12, Issue 03

Original 45nm Intel® Core™ Microarchitecture

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ISSN 1535-864X DOI 10.1535/itj.1203.04

• Volume 12
• Issue 03
• Published November 7, 2008

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• Original 45nm Intel® Core™ Microarchitecture

Original 45nm Intel® Core™ Microarchitecture

  Section 9 of 10  

Mobility Thin and Small Form-Factor Packaging for Intel® Processors Based on Original 45nm Intel Core™ Microarchitecture

REFERENCES

[1] A. Waizman. “Integrated power supply frequency domain impedance meter (IFDIM).” In Proceedings of IEEE: 13 ^th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 217-220, 2004.

  Section 9 of 10  

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In this article

• Abstract
• Introduction
• Overview of the 3-MB Pin Grid Array and Small Form Factor Packages
• Package Design—Small Form Factor
• Platform and Substrate Power-Delivery Challenges and Implementations
• Package Design Teams’ Challenge
• Conclusion
• Acknowledgments
• References
• Authors’ Biographies