Original 45nm Intel® Core™ Microarchitecture

The Technical Challenges of Transitioning Intel® PRO/Wireless Solutions to a Half-Mini Card

Authors’ Biographies

Eli Laks
is a Senior HWRF Design Engineer in the Mobile Wireless Group. Currently he is working on Intel® ProWireless Multi-Comm solutions for Notebook platforms. He specializes in RF board design, general hardware design, and regulatory certification validation. In 2005 he joined Intel as a Senior HWRF Design Engineer. During 1980–2004 he was employed on and off by MicroKim Ltd. as the R&D Manager (CTO). He developed multi-function hybrid RF synthesizers and small RF systems. In 1991 Eli founded a start-up company called Eilon Engineering that developed weighing and force measurement systems. Eli received his B.Sc.E.E. degree from the Technion, Israel in 1985. His e-mail is eli.laks at intel.com.

Richard S. Perry
is a Manufacturing Architect in the Mobile Wireless Group. He specializes in the areas of PCB technology, FEM substrate and package design, Si package design, and halogen-free product design for next-generation Intel® PROWireless solutions. In January 2000 he joined Intel Corporation focusing on the wireless technology development for PCB design and PCB assembly. From 1994 to 2000 he was employed with Ericsson, Cellular Phones Division, as a Senior Manufacturing Engineer and an Operations Engineering Manager for digital phone manufacturing. Richard received a B.S.E.E. degree from Clemson University in 1996. His e-mail is richard.s.perry at intel.com.

Brad Saunders
is a Senior Mobile Systems Architect focusing on platform IO technology definition in Intel Corporation's Mobility Group. Brad also leads the PCMCIA industry group responsible for the ExpressCard standard and is the technical editor for the PCI Express Mini electro-mechanical specifications within the PCI-SIG. Brad came to Intel Corporation as part of the Xircom, Inc. acquisition in early 2001, where he had spent two years in Xircom's chief technology office. Prior to that, he spent 21 years working in various fields of communications at Rockwell International, ranging from secure communications for defense applications to analog modems for mobile systems. Brad received his B.S.E.E. degree from the University of California, Irvine in 1976. His e-mail is brad.saunders at intel.com.

Ra’anan Sover
is a HWRF Architect in the Mobile Wireless Group. Currently he is working on Multi-Comm solutions for both notebook and hand-held platforms. He was directly involved in the definition, implementation, integration, and productization of Intel® ProWireless Wi-Fi products. In May 2000 he joined Intel as a Senior Radio Frequency Integrated Circuit (RFIC) Design Engineer and co-designed the synthesizer block of Intel's first WLAN RFIC. From 1988-2000, he was employed by MicroKim Ltd. as a Senior RF Engineer. He developed multi-function hybrid RF synthesizers and control devices. Ra’anan received his B.Sc.E.E. degree from the Technion, Israel in 1988. He is a Senior Member of the IEEE. His e-mail is raanan.sover at intel.com.

All codenames featured in this article are used internally within Intel to identify past and future products, some of which have not been publicly announced for release. Customers, licensees, and other third parties are not authorized by Intel to use these codenames in advertising, promotion, or marketing of any product or services, and any such use of Intel's internal codenames is at the sole risk of the user.

MC Mini Card—also referred to as Full-Mini Card

HMC—Half-Mini Card

CMT—Centrino™ Mobile Technology

WLAN—Wireless Local Area Network

MAC/BB—Media Access Controller/Base Band

MIMO—Multiple In Multiple Out

Mbps—megabits per second

PCI SIG—Peripheral Component Interconnect Special Interest Group

PCB—Printed Circuit Board

CS—Component Side (usually referred as to the top)

PS—Print Side (usually referred to as the bottom)

BGA—Ball Grid Array

QFN—Quad, Flat, No-lead

WB—Wire Bond

HDI—High Density Interconnect

THV—Through Hole Via

UVia—Microvia

RF—Radio Frequency

RFIC—Radio Frequency Integrated Circuit

FEM—Front End Module

PA—Power Amplifier

LNA—Low Noise Amplifier

PMU—Power Management Unit

DC/DC—Direct Current to Direct Current

EEPROM—Electrically Erasable Programmable Read Only Memory

IPC—Printed Circuit Standard body

EMI/RFI—Electro Magnetic Interference/Radio Frequency Interference

IR—Current x Resistance (voltage)

GND—Ground

EVM—Error Vector Magnitude

UL—Up Link

DL—Down Link

I/O—Input/Output

DB—decibel (a relative unit of measure)

Tj—Temperature @ die junction

WG—Work Group

BTO—Built To Order

LCD—Liquid Crystal Display

DoE—Design of Experiment

OEM—Original Equipment Manufacturer

USB—Universal Serial Bus

Xtal—Crystal

UDP—User Datagram Protocol

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