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- Past Journals 2008
The most recent issues are available in both HTML and PDF formats. Earlier issues are in PDF format only. The links next to the titles indicate available formats.
Q4
Vol. 12 Issue 4 (December 2008) Intel® vPro™ Technology [HTML]
- Preface [HTML]
- Foreword – Gregory Bryant, Vice President, Business Client Group; General Manager, Digital Office Platform Division, Intel Corporation [HTML]
- Advanced Security Features of Intel® vPro™ Technology [HTML]
- Storage Protection with Intel® Anti-Theft Technology [HTML]
- Innovating Above and Beyond Standards [HTML]
- Configuring Intel® Active Management Technology [HTML]
- Remote System Repair Using Intel® vPro™ Technology [HTML]
- Mobile Manageability in Low-Power and Operating-System-Absent States [HTML]
- Power Efficiency and Sustainable Information Technology [HTML]
- Enabling Dynamic Virtual Client Computing with Intel® vPro™ Technology [HTML]
- Next-Generation Streaming Clients, Based on Intel® vPro™ Technology [HTML]
- Extreme Programming with Intel® vPro™ Technology: Pushing the Limits with Innovative Software [HTML]
Q3
Vol. 12 Issue 3 (November 2008) Original 45nm Intel® Core™ Microarchitecture [HTML] [Entire Issue PDF, 1.91 MB]
- Preface [HTML]
- Foreword – Ofri Wechsler, Intel Fellow, Manager, MG CPU Architecture [HTML]
-
Original 45nm Intel® Core™2 Processor Performance [HTML]
[PDF 593 KB] -
Power Management Enhancements in the 45nm Intel® Core™ Microarchitecture [HTML]
[PDF 241 KB] -
Improvements in the Intel® Core™2 Penryn Processor Family Architecture and Microarchitecture [HTML]
[PDF 458 KB] -
Mobility Thin and Small Form-Factor Packaging for Intel® Processors Based on Original 45nm Intel Core Microarchitecture [HTML]
[PDF 302 KB] -
The Technical Challenges of Transitioning Intel® PRO/Wireless Solutions to a Half-Mini Card [HTML]
[PDF 381 KB] -
Greater Mobility Through Lower Power [HTML]
[PDF 302 KB] -
Power Improvements on 2008 Desktop Platforms [HTML]
[PDF 275 KB]
Q2
Vol. 12 Issue 2 (June 2008) Intel's 45nm CMOS Technology [HTML] [Entire Issue PDF, 4.45 MB]
- Preface [HTML]
- Foreword – Bill Holt, Senior Vice President, General Manager, Technology and Manufacturing Group [HTML]
-
45nm High-k+Metal Gate Strain-Enhanced Transistors [HTML]
[PDF 1.14 MB] -
Process and Electrical Results for the On-die Interconnect Stack for Intel's 45nm Process Generation [HTML]
[PDF 1.15 MB] -
Managing Process Variation in Intel's 45nm CMOS Technology [HTML]
[PDF 1.53 MB] -
45nm SRAM Technology Development and Technology Lead Vehicle [HTML]
[PDF 1.08 MB] -
45nm Design for Manufacturing [HTML]
[PDF 1.33 MB] -
45nm Transistor Reliability [HTML]
[PDF 1.06 MB] -
Flip-Chip Packaging Technology for Enabling 45nm Products [HTML]
[PDF 1.45 MB]
Q1
Vol. 12 Issue 1 (February 2008) Technology with the Environment in Mind [HTML] [Entire Issue PDF, 4.55 MB]
- Preface [HTML]
- Foreword – Ted Reichelt, Principal Environmental Engineer, Global Environmental Group [HTML]
-
Materials Technology for Environmentally Green Micro-electronic Packaging [HTML]
[PDF 1.37 MB] -
Making USB a More Energy-Efficient Interconnect [HTML]
[PDF 546 KB] -
Intel's First Designed and Built Green Building [HTML]
[PDF 1.96 MB] -
Green Homeowners as Lead Adopters: Sustainable Living and Green Computing [HTML]
[PDF 348 KB] -
Novel Wastewater Reclamation Technology Meets Environmental and Business Challenges [HTML]
[PDF 393 KB] -
Dynamic Data Center Power Management: Trends, Issues, and Solutions [HTML]
[PDF 819 KB] -
Evaluation Process for Semiconductor Fabrication Materials that are Better for the Environment [HTML]
[PDF 554 KB]