Technology with the Environment in Mind

Foreword

• Foreword

  Ted Reichelt
  Principal Environmental Engineer, Global Environmental Group, Intel Corporation

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Current Articles

Products for a Greener Future

• Materials Technology for Environmentally Green Micro-electronic Packaging

  Learn how the delivery of lead-free packaging solutions reinforced Intel’s commitment to provide environmentally friendly micro-electronic packaging.

• Making USB a More Energy-Efficient Interconnect

  Explore how the classic Universal Serial Bus can become an energy-efficient interconnect in a world where environmentalism and “green” computing need to be given priority by corporations and consumers alike.

Greener Buildings and Lifestyles

• Intel’s First Designed and Built Green Building

  Intel’s first “green” R&D building is driving innovation in a large corporation and educating a local building industry at the same time.

• Green Homeowners as Lead Adopters: Sustainable Living and Green Computing

  How does green consumerism affect the purchasing decisions and technology usage of people who prioritize environmental values in their lives and homes?

Greener Manufacturing and Operations

• Novel Wastewater Reclamation Technology Meets Environmental and Business Challenges

  Read the story of how an entire wastewater stream at a new Intel facility was treated to achieve a very high level of effluent quality.

• Dynamic Data Center Power Management: Trends, Issues, and Solutions

  Learn about a power-management solution that maximizes the usage of existing power capacity in data centers and still meets the continuing business innovation needs of the corporation.

• Evaluation Process for Semiconductor Fabrication Materials that are Better for the Environment

  The increasing complexity and miniaturization of microchips call for ultrapure chemicals that need to be selected very early on in the development cycle.

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